DIP (Dual Inline Pckage) 双列直插式封装

DIMM (Dual Inline Memory Module) 双列直插存贮型组件

Can (l Can Package) 金属壳封装

BeamChip 梁式芯片

Beaml (BeamLead Package) 梁式引线封装

Zip tab (Zig Zag Inline with lHealHeatsink) 带散热片的Z形引线单列直插式

DIPtab (DIPackage with Meatlheatsink) 带散热片的双列直插封装

FP (Flat Package) 扁平封装

FPL (Flat Package "L" Leads) L引线扁平封装

PLCC (Plastic Leaded Chip Carrier) 引线片装

RFMOD (Radio Frequency Module) 无线电频率组件

SIP (Single Inline Package) 单列直插式封装

SIPtab (SIP with l Heatsink) 带散热片的单列直插式封装

SOP (Small Outline DIP) 短输出双列贴片封装

ZIP (Zip Zag Inline Package) Z形引线单列直插式封装

LCC (Leadless Chip Carrier) 无引线片载

Module (Modular Package) 组合式封装

QFP(F) (Flat Package Quad stgle) 四向扁平封装

QUIP (Quad Inline Package) 四列直插式封装

QUIPtab (QUIP with l Heatsink) 带散热片的四列直插封装